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NEW QUESTION: 1
Your organization is implementing SAP ERP Material Planning. Your team is creating bills of material (BOM). You explain to your team that the bill of material contains the assemblies or components which are to be included in the production of a material.Which of the following correctly describe the features of bills of material?(Choose two)
A. BOM usage determines the business applications for which a BOM can be used.
B. Bills of material are created and maintained as multilevel bills.
C. All components listed in the BOM line items require a material master record.
D. The base quantity, in the BOM header, specifies the amount of the finished product that the item quantities refer to.
Answer: A,D

NEW QUESTION: 2
Your customer wants to change the Need by Date of an open Purchase Order. To make this change, a
Change Order is initiated by the customer and the request is now being reviewed by I he supplier. What will the status of the Purchase Order and the Change Order In the system?
A. Purchase Order: Pending Supplier Acknowledgement; Change Order: Pending Supplier
Acknowledgement
B. Purchase Order: Pending Supplier Acknowledgement; Change Order: Open
C. Purchase Order: Open; Change Order: Now
D. Purchase Order: Open; Change Order: Pending Supplier Acknowledgement
E. Pun base Order: Open; Change Order: Open
Answer: A,B

NEW QUESTION: 3

---

A. Option D
B. Option B
C. Option C
D. Option A
Answer: C
Explanation:
Database Snapshots (SQL Server)

NEW QUESTION: 4
Which two statements about Packet over SONET are true? (Choose two.)
A. The FCS field can be set to 16 bits on one end and 32 bits on the other end of a POS connection without causing any connectivity issues.
B. POS can be used in a point-to-point or point-to-multipoint environment.
C. The Cisco POS interface supports Cisco HDLC and PPP encapsulation.
D. POS is a Layer 2 technology that uses PPP in ATM encapsulation and SONET framing.
E. The Layer 2 frame is encapsulated into a generic HDLC header (not Cisco proprietary HDLC) and placed into the appropriate SONET Payload Envelope.
Answer: C,E